BIWIN Storage Technology Co., Ltd.

Certifications

• ISO9001
• ISO14001
• IATF16949 (Automotive Quality Management)
• AEO Advanced Certification from Customs

Main Products & Services

A leading independent semiconductor storage solution provider in the AI era, ranked as a top domestic storage chip manufacturer in China and listed on the SSE STAR Market (688525.SH).

Core Products

• Embedded Storage (eMMC, UFS, LPDDR, eMCP, ePOP)
• PC Storage (SSD, DRAM modules)
• Industrial and Automotive Grade Storage
• Enterprise-class Storage
• Mobile Storage (Portable SSDs, Memory Cards, USB Drives)
• Advanced Packaging and Testing Services (SiP, Hybrid BGA, FC-CSP)

Service Areas

• Mobile intelligent terminals
• PC and Servers
• Data Centers
• Smart Automotive
• Industrial IoT
• Wearable Devices (AI glasses, smartwatches)

Integrated R&D and manufacturing (packaging/testing) model, proprietary firmware algorithms, and global brand operations for BIWIN, HP, Acer, and Predator.

Company Information

Location

Shenzhen, Guangdong, China (Headquarters: Nanshan District)

Established

September 6, 2010

Registered Capital

470,836,710 RMB

Business Scope

R&D, design, packaging, testing, production, and sales of semiconductor memory products and advanced packaging services.

Production Capacity

Main manufacturing hub at Biwin Huizhou Science Park (Greater Bay Advanced Technology Co., Ltd.) with a 110,000 m² facility; additional facilities in Dongguan.

Financial Overview

Achieved revenue of 6.814 billion RMB in Q1 2026 (341.53% YoY increase); 2025 annual revenue reached approximately 11.3 billion RMB.

Mission: 'Storage Empowers Everything'; Vision: To become a world-class storage and advanced packaging/testing provider.

Major Projects & Clients

Notable Projects

• Strategic brand licensing partnerships with HP and Acer for global storage product distribution
• Development of enterprise-grade QLC SSDs for AI computing power demand
• Biwin Huizhou Science and Technology Park (Key IC Project)

Key Clients

• Lenovo
• Google
• Meta
• HP
• Acer
• Various PC OEMs and smartphone manufacturers

Industry Applications

• Consumer Electronics
• Enterprise Computing
• Automotive Electronics
• Industrial Control
• AI Computing Infrastructure

Team & R&D

Team size: Approximately 2,852 employees (as of 2024/2025 reports)

R&D capabilities: Integrated R&D approach from concept to production, with 4 R&D centers and expertise in IC design, firmware, and testing equipment development.

Technical expertise: NAND Flash application research, SiP (System-in-Package) technology, storage algorithms, and advanced semiconductor testing.

Management

• Sun Chengsi (Chairman and Legal Representative)
• He Han (General Manager)
• Huang Yanfeng (Secretary of the Board)

Overseas Layout

Production Bases

• None found: No specific overseas production factories were identified in the search results; manufacturing is primarily concentrated in Huizhou and Dongguan, China.

Sales Offices

• Miami, USA: BIWIN Technology LLC: 8725 NW 18th Terrace, Suite 400, Miami, FL 33172
• Fremont, USA: Windisk Inc.: 4057 Clipper Court, Fremont, CA 94538
• Hong Kong, China: Biwin Storage Technology (HK) Limited: Unit 208-209, 2/F, Block B, Po Lung Centre, 11 Wang Chiu Road, Kowloon Bay, Hong Kong
• Taipei, Taiwan: Biwin Semiconductor (HK) Company Limited (Taiwan Office): 3F, No. 162, Xinhu 2nd Rd., Neihu Dist., Taipei City 114065
• Germany: European sales and marketing presence (Phone: +49 (0) 6504 9567 911)

Investment Companies

• Biwin Technology LLC — Miami, Florida, USA: Wholly-owned subsidiary for North American market operations
• Biwin Semiconductor (HK) Company Limited — Hong Kong: Wholly-owned subsidiary for international trade and regional operations

Global strategy: Global brand operation strategy leveraging licensed brands (HP, Acer) and a worldwide sales network covering North America, Europe, and Asia.

Overseas revenue: Approximately 53.35% (as of 2025 financial breakdown)