Biren Technology

Certifications

• Information on specific ISO certifications was not found in the search results, though the company holds 5 administrative licenses.

Main Products & Services

Leading Chinese fabless semiconductor design company specializing in high-end general-purpose GPUs (GPGPUs) for AI training and high-performance computing, positioned as a domestic competitor to NVIDIA.

Core Products

• BR100 Series (BR100, BR104 GPGPUs)
• BR106, BR110, BR116 Chips
• Next-generation BR20X series (planned for 2026)
• BIRENSUPA Software Platform
• Air-cooled and Liquid-cooled OAM modules
• PCIe Acceleration Cards

Service Areas

• AI Data Centers
• Cloud Computing
• Telecommunications
• Financial Technology (Fintech)
• Energy and Public Utilities
• Internet Services

Utilizes original core architecture and Chiplet-based high-performance computing; supports large language model (LLM) training and inference; features high computing density and optical interconnect technology (LightSphere X).

Company Information

Location

Room 1302, 13th Floor, Building 16, No. 2388 Chenhang Road, Minhang District, Shanghai, China.

Established

2019

Registered Capital

48.777 million RMB

Business Scope

Integrated circuit chip design and services, computer software technology development, technical services, system integration, and import/export of software and auxiliary equipment.

Production Capacity

Fabless model (outsources manufacturing to foundries); currently scaling mass production of BR106 and BR166 series.

Financial Overview

Listed on the Hong Kong Stock Exchange (SEHK: 06082) on January 2, 2026. H1 2026 revenue projected at 1.15-1.30 billion RMB (up over 1,800% YoY). Market capitalization reached approximately 85.54 billion HKD at IPO.

Focuses on original architecture, international vision, and technological self-sufficiency in high-end computing.

Major Projects & Clients

Notable Projects

• LightSphere X Super-node solution (SAIL Award winner at 2025 WAIC)
• Deployment of a 2,048-card optical interconnect GPU super-node cluster on a national-level computing platform
• Delivery of multiple thousand-card intelligent computing clusters

Key Clients

• Cloud Service Providers
• AI Data Centers
• Major Chinese Internet Companies
• National-level computing platforms

Industry Applications

• Artificial Intelligence training and inference
• Graphics rendering
• High-performance computing (HPC)
• Smart city and industrial AI solutions

Team & R&D

Team size: Approximately 500-999 employees (643 insured per Tianyancha; 842 per Investing.com).

R&D capabilities: High R&D intensity with 1.48 billion CNY invested in 2025 (78.5% year-on-year increase); focus on GPGPU, DSA (dedicated accelerators), and computer architecture.

Technical expertise: Chiplet design, software-hardware co-innovation, GPGPU architecture, and optical data transmission for super-node scaling.

Management

• Zhang Wen (Founder, Chairman, and CEO)
• Hong Zhou (CTO and Executive Director)
• Linglan Zhang (COO and Executive Director)
• Bing Xiao (GM and Executive Director)
• Luting Pan (Secretary of the Board)

Overseas Layout

Sales Offices

• Hong Kong, Wan Chai: Unit D, 16/F One Capital Place, 18 Luard Rd; serves as a key international hub and listed entity office.

Investment Companies

• Yunsilicon Technology — China (Domestic investment): Strategic investment/acquisition to strengthen the computing ecosystem.

Global strategy: Aims to participate in formulating future industry standards with an international vision, despite being impacted by US trade restrictions. Presence in Singapore is noted in regulatory filings (Entity List), though specific office addresses for the GPU entity were not found in the search results.

Overseas revenue: Information on the specific percentage of overseas revenue was not found; business activities are primarily focused in the PRC.